Brian Wu

Hukou Operation Center, Vice President at Chipbond Technology Corporation.

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John Espallardo

Chief Process Engineer (WLCSP Wet Clean -Strip, Etch, Ball Placement) at Chipbond Technology Corporation.

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Roger Lo

Senior Chief Engineer at Chipbond Technology Corporation.

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Shane Lin

人力資源資深管理師 Human Resource Chief Officer at Chipbond Technology Corporation.

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Tu Jiarong

Assistant Vice President at Chipbond Technology Corporation.

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