John Espallardo
Chief Process Engineer (Wlcsp Wet Clean -Strip, Etch, Ball Placement) at Chipbond Technology Corporation.
Others working in Chipbond Technology Corporation.
Roger Lo
Senior Chief Engineer at Chipbond Technology Corporation.
Email
View
Phone
View
Shane Lin
人力資源資深管理師 Human Resource Chief Officer at Chipbond Technology Corporation.
Email
View
Phone
View
Brian Wu
Hukou Operation Center, Vice President at Chipbond Technology Corporation.
Email
View
Phone
View
Tu Jiarong
Assistant Vice President at Chipbond Technology Corporation.
Email
View
Phone
View
John Espallardo's current Workspace
People similar to John Espallardo
Jose Espallardo
Country Manager Portugal and Business Director Spain at Lawofficeofronalds
Email
View
Phone
View
Olga Espallardo
Market Access and Public Affairs Senior Director at Novo Nordisk
Email
View
Phone
View
Rome Espallardo
Account Executive at Zoom
Email
View
Phone
View
Marjorie Espallardo
Assistant Manager at inf
Email
View
Phone
View
Wilmer Espallardo
Field Manager at Sun Life
Email
View
Phone
View
Jose Espallardo
BIM Manager / BIM Architect at KPS Interiors
Email
View
Phone
View